Power chips are attached to outside circuits with packaging, and their efficiency relies on the assistance of the product packaging. In high-power situations, power chips are normally packaged as power components. Chip interconnection refers to the electric connection on the upper surface of the chip, which is generally light weight aluminum bonding cord in typical modules. ^
Typical power module plan cross-section
Currently, commercial silicon carbide power components still mostly utilize the packaging modern technology of this wire-bonded standard silicon IGBT module. They encounter problems such as big high-frequency parasitic specifications, inadequate warm dissipation capacity, low-temperature resistance, and not enough insulation stamina, which limit the use of silicon carbide semiconductors. The display of superb efficiency. In order to fix these issues and completely make use of the huge prospective benefits of silicon carbide chips, numerous brand-new packaging modern technologies and solutions for silicon carbide power modules have actually arised in the last few years.
Silicon carbide power component bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have established from gold cords to copper wires, and the driving pressure is price reduction; high-power tools have actually developed from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to boost product efficiency. The greater the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that makes use of a solid copper bridge soldered to solder to connect chips and pins. Compared to conventional bonding product packaging methods, Cu Clip modern technology has the adhering to benefits:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a specific degree, changes the conventional cord bonding approach between the chip and the pins. Consequently, a special bundle resistance value, higher current circulation, and better thermal conductivity can be obtained.
2. The lead pin welding area does not require to be silver-plated, which can totally save the expense of silver plating and inadequate silver plating.
3. The item appearance is totally regular with normal items and is mostly made use of in servers, portable computers, batteries/drives, graphics cards, motors, power products, and other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding technique
Both the Gate pad and the Resource pad are clip-based. This bonding approach is a lot more expensive and complicated, but it can accomplish much better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cord bonding method
The resource pad uses a Clip approach, and eviction makes use of a Cable approach. This bonding approach is somewhat less costly than the all-copper bonding technique, saving wafer location (applicable to extremely small gateway locations). The procedure is simpler than the all-copper bonding method and can obtain better Rdson and much better thermal result.
Supplier of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper stripes, please feel free to contact us and send an inquiry.
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